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PCB CAPABILITIES

SPECIFICATION STANDARD
Minimum conductor width 6 mils(0.15 mm)
Minimum conductor Spacing/Air gap 6 mils(0.15 mm)
Minimum Plated hole size 16 mils(0.4mm)
Maximum Plated hole size 240 mils(6mm)
Maximum board size 300 mm x 350 mm
Maximum number of layers 2
Minimum copper thickness 1 Oz (35 microns)
Maximum copper thickness 3 Oz (105 microns)
Dedicated Electrical Testing (BBT) Available
PCB Cutting options Routing , V groove , Punching
PRODUCT FINISHED
Single Sided HAL, Lacquer
Double Sided HAL, TIN , Electroplated Gold & Nickel
Solder Mask Finish PISM, Liquid Solder Mask
Solder Mask color Green, White, Black, Blue ,Red
Legend/Ident color White, Black, yellow, Green
Special Requirement Carbon Printing on Push Button , Selective Gold & Nickel plating on Connecting Tabs
Minimum copper thickness 1 Oz (35 microns)
Maximum copper thickness 3 Oz (105 microns)
Dedicated Electrical Testing (BBT) Available
PCB Cutting options Routing , V groove , Punching
PRODUCT RAW MATERIAL
Single Sided FR1,FR4, CEM1,CEM3, PP, Metal Clad
Double Sided FR4
Board Thickness (in mm) 0.4 , 0.8 ,1.0 , 1.2, 1.6 ,2.4 , 3.2