| SPECIFICATION | STANDARD |
|---|---|
| Minimum conductor width | 6 mils(0.15 mm) |
| Minimum conductor Spacing/Air gap | 6 mils(0.15 mm) |
| Minimum Plated hole size | 16 mils(0.4mm) |
| Maximum Plated hole size | 240 mils(6mm) |
| Maximum board size | 300 mm x 350 mm |
| Maximum number of layers | 2 |
| Minimum copper thickness | 1 Oz (35 microns) |
| Maximum copper thickness | 3 Oz (105 microns) |
| Dedicated Electrical Testing (BBT) | Available |
| PCB Cutting options | Routing , V groove , Punching |
| PRODUCT FINISHED | |
|---|---|
| Single Sided | HAL, Lacquer |
| Double Sided | HAL, TIN , Electroplated Gold & Nickel |
| Solder Mask Finish | PISM, Liquid Solder Mask |
| Solder Mask color | Green, White, Black, Blue ,Red |
| Legend/Ident color | White, Black, yellow, Green |
| Special Requirement | Carbon Printing on Push Button , Selective Gold & Nickel plating on Connecting Tabs |
| Minimum copper thickness | 1 Oz (35 microns) |
| Maximum copper thickness | 3 Oz (105 microns) |
| Dedicated Electrical Testing (BBT) | Available |
| PCB Cutting options | Routing , V groove , Punching |
| PRODUCT RAW MATERIAL | |
|---|---|
| Single Sided | FR1,FR4, CEM1,CEM3, PP, Metal Clad |
| Double Sided | FR4 |
| Board Thickness (in mm) | 0.4 , 0.8 ,1.0 , 1.2, 1.6 ,2.4 , 3.2 |
